The SUSS SB6L is the ideal complement to the SUSS Bond Aligner. It is a universal tool for wafer bonding processes for micro electro-mechanical system applications such as: Anodic Bonding, Silicon Fusion Bonding, Adhesive Bonding (AB) (SFB), Thermal Compression Bonding (TCB) (ADB) After alignment on the Bond Aligner, the substrate stacks are mechanically clamped using the transport fixture for further processing in the Substrate Bonder. 

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SB6L

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