BA8
Category
BondersOverview
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
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1
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Inspection, Insurance, Appraisal, Logistics
The semi-automated bond aligner BA8 is designed for high-precision alignment and subsequent reliable bonding of wafers and substrates up to 200 mm.
1
Inspection, Insurance, Appraisal, Logistics
