Description
Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta RotationConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
KULICKE & SOFFA (K&S)
6496
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21401
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S)
6496
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21401
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Semiautomatic Flip Chip Die Bonder ±1.2 Mil @ 3 Sigma Placement Accuracy 50 to 3000 grams Bond Force Range 10sq. mil – 1000sq.mil Die Size Range 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution 0.2 mrad/motor pulse Theta RotationConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents