Description
Universal BonderConfiguration
No ConfigurationOEM Model Description
Universal Die Bonder - most versatile semi-automatic Flip-Chip PlatformDocuments
No documents
JFP MICROTECHNIC
PP6
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
70562
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllJFP MICROTECHNIC
PP6
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
70562
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Universal BonderConfiguration
No ConfigurationOEM Model Description
Universal Die Bonder - most versatile semi-automatic Flip-Chip PlatformDocuments
No documents