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Brand-new deep access head (90°)OEM Model Description
Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.Documents
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HESSE & KNIPPS
BONDJET 820
Verified
CATEGORY
Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
101164
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HESSE & KNIPPS
BONDJET 820
CATEGORY
Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
101164
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Brand-new deep access head (90°)OEM Model Description
Introducing the Bondjet BJ820: High-Speed Fully Automatic Fine Wire Wedge Bonder. It excels in wire bonding for diverse applications like RF devices, COB, MCM, automotive, etc., with aluminum, gold, or ribbon wire. Unmatched speed, precision, and flexibility make it an industry benchmark. Real-time bond quality monitoring, intelligent automation, and optimized tool change further enhance its capabilities. Up to 7 wires/sec, 1 μm at 3 σ axis repeatability, and a large 305mm x 410mm bonding area. Offers loop length adjustment from 70 µm up to 20 mm.Documents
No documents