Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.Documents
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EVGroup (EVG)
EVG850 TB
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
81290
Wafer Sizes:
Unknown
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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EVGroup (EVG)
EVG850 TB
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
81290
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.Documents
No documents