Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.Documents
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EVGroup (EVG)
EVG510
Verified
CATEGORY
Bonders
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102964
Wafer Sizes:
12"/300mm
Vintage:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
Available
EVGroup (EVG)
EVG510
CATEGORY
Bonders
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102964
Wafer Sizes:
12"/300mm
Vintage:
2023
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The EVG®510 is a semi-automated wafer bonding system that is versatile and quick to adapt. It can accommodate various substrate sizes, ranging from pieces to 200 mm. It is compatible with all standard wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct. Its design allows for swift retooling for different wafer sizes and processes, with a conversion time of less than 5 minutes.Documents
No documents