Description
No descriptionConfiguration
-Unit setup for thermal bonding and hot embossing. -Windows 2000 -Unit setup for thermal bonding, not anodic bonding. -Will need to hook it to a three phase power source and compressed air/ nitrogen. -Fully operational -Last used in 2019OEM Model Description
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs.Documents
EVGroup (EVG)
EVG520 HE
Verified
CATEGORY
Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55796
Wafer Sizes:
8"/200mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
CATEGORY
Bonders
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55796
Wafer Sizes:
8"/200mm
Vintage:
2005
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available