Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.Documents
No documents
BESI / ESEC
2100 xP plus
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79188
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
BESI / ESEC
2100 xP plus
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79188
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Fastest 12" Epoxy Die Bonder The revolutionary Phi-Y pick-and-place produces a quantum leap in speed, with an increasing standard accuracy of 20 µm. Optionally, the accuracy can even be improved, down to 15 µm. minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest settling times imaginable, which ultimately lead to unsurpassed speed of the Die Bonder Esec 2100 xP plus.Documents
No documents