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BESI / ESEC 2100 FC
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
    Documents

    No documents

    BESI / ESEC

    2100 FC

    verified-listing-icon

    Verified

    CATEGORY
    Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    63096

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
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    Available
    Money Back Guarantee
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    Transaction Insured by Moov
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    BESI / ESEC 2100 FC

    BESI / ESEC

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    Vintage: 2013Condition: Used
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    BESI / ESEC

    2100 FC

    verified-listing-icon
    Verified
    CATEGORY
    Bonders
    Last Verified: Over 60 days ago
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/ac6e11a1fa0d48d0865ed898085c5e03_1971663739955_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/d4872ed583544887bf7b49c9329229f4_1981663739955_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/d41c862694354fa8a79da75ba859d2aa_1991663739955_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/a52cd6014caa458eaa232b2a44ac5d3a_2001663739955_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/9b1927d1808a43efb1028c8ef20e19f2_2011663739955_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/c91dd2f0aa75457bba8eff9dedc11b60_2021663739969_mw.jpg
    listing-photo-27b87cc4e41a43299248b4f8b2f0b30e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44736/27b87cc4e41a43299248b4f8b2f0b30e/faa61666cae2447e892681fee4e22dec_2041663740003_mw.jpg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    63096

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Flip Chip Bonder Esec 2100 FC hS capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    BondersVintage: 2017Condition: UsedLast Verified: Over 60 days ago
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago
    BESI / ESEC 2100 FC

    BESI / ESEC

    2100 FC

    BondersVintage: 2013Condition: UsedLast Verified: Over 60 days ago