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BESI / ESEC 2100 DS
    Description
    No description
    Configuration
    Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding Capability
    OEM Model Description
    Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.
    Documents

    No documents

    BESI / ESEC

    2100 DS

    verified-listing-icon

    Verified

    CATEGORY
    Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    30490

    Wafer Sizes:

    8"/200mm

    Vintage:

    Unknown

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    Similar Listings
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    BESI / ESEC 2100 DS

    BESI / ESEC

    2100 DS

    Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2100 DS

    verified-listing-icon
    Verified
    CATEGORY
    Bonders
    Last Verified: Over 60 days ago
    listing-photo-57425b8e9a2d45f48e20393bad3c066e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1093/57425b8e9a2d45f48e20393bad3c066e/fadaa8b222b546a2b4c1f450c7a665fe_163397a02baa4095bba21903db51dfb445005c_m.jpeg
    listing-photo-57425b8e9a2d45f48e20393bad3c066e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1093/57425b8e9a2d45f48e20393bad3c066e/2630da4b92b44bafa8b4b3601401488f_7c670b4044d94622b22949dd274df4fe45005c_m.jpeg
    listing-photo-57425b8e9a2d45f48e20393bad3c066e-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1093/57425b8e9a2d45f48e20393bad3c066e/398726bf1591469fbe8f65c235f0dd3e_screenshot20210112at3_m.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    30490

    Wafer Sizes:

    8"/200mm

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Installed wafermap and barcode reader, can recognize XML.AWW and other wafermap format Bonding Capability
    OEM Model Description
    Esec 2100 DS, the flexible and fast high temperature Die Bonding Platform for Leadframe Applications. The latest member of the field proven standard machine for high end production is combining the revolutionary Phi-Y pick & place and a flexible hot tunnel strip handler with forming gas or nitrogen atmosphere. The Esec 2100 DS is the most flexible and versatile Die Bonder for diffusion soldering and sintering for the time to come.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2100 DS

    BESI / ESEC

    2100 DS

    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago