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BESI / ESEC 2008 hS3 plus
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
    Documents

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    BESI / ESEC

    2008 hS3 plus

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    27408

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    BESI / ESEC 2008 hS3 plus
    BESI / ESEC2008 hS3 plusBonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / ESEC

    2008 hS3 plus

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-cd4804b32a3149588cb69fce61841c10-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/cd4804b32a3149588cb69fce61841c10/992d9456b9df41d49749fcde89abb386_5187cd3fecce4386baa3aad34fe2ccae45005c_f.jpeg
    listing-photo-cd4804b32a3149588cb69fce61841c10-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/cd4804b32a3149588cb69fce61841c10/4980f804fbf04ec5927b17ad349f623b_9bf5441e01ba427c8dc0048bd6a4f37e_m.png
    listing-photo-cd4804b32a3149588cb69fce61841c10-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/cd4804b32a3149588cb69fce61841c10/212029e4abdd426a972fb347d6cac1df_7192428d7e004147a583f6918778973e45005c_f.jpeg
    listing-photo-cd4804b32a3149588cb69fce61841c10-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1108/cd4804b32a3149588cb69fce61841c10/512c621fb57a4029ad7f3ed9f9737d36_326c71957f454028b2f4285227f50ba6_m.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    27408

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ESEC 2008hs3 Plus is a die bonder manufactured by ESEC. It is designed to handle wafers up to 300mm in size and has a bond accuracy of 25 um @ 3 sigma. This tool is capable of precisely attaching dies to substrates with a high degree of accuracy, making it a valuable tool in the semiconductor manufacturing process.
    Documents

    No documents

    Similar Listings
    View All
    BESI / ESEC 2008 hS3 plus
    BESI / ESEC
    2008 hS3 plus
    BondersVintage: 2009Condition: UsedLast Verified: 26 days ago
    BESI / ESEC 2008 hS3 plus
    BESI / ESEC
    2008 hS3 plus
    BondersVintage: 0Condition: UsedLast Verified: Over 60 days ago