Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.Documents
No documents
BESI / ESEC
2007 SSI
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80295
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
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BESI / ESEC
2007 SSI
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80295
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The key characteristic of the power semiconductor packaging market is its need for continuous technological progress. Shrinking package sizes, cost reduction, switching power enhancements and the integration of intelligent control circuits in smart power packages are the most crucial aspects.Documents
No documents