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ASM TWIN EAGLE XTREME
    Description
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    Configuration
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    OEM Model Description
    The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.
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    ASM

    TWIN EAGLE XTREME

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    13896

    Wafer Sizes:

    Unknown

    Vintage:

    2010

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    ASM TWIN EAGLE XTREME
    ASMTWIN EAGLE XTREMEBonders
    Vintage: 2010Condition: Used
    Last VerifiedOver 60 days ago
    ASM TWIN EAGLE XTREME
    ASMTWIN EAGLE XTREMEBonders
    Vintage: 2011Condition: Used
    Last VerifiedOver 60 days ago

    ASM

    TWIN EAGLE XTREME

    verified-listing-icon

    Verified

    CATEGORY

    Bonders
    Last Verified: Over 60 days ago
    listing-photo-8isQeaUTqQwn-o6brt0FjfuMPanNFWi5ZGS41li-BL4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1097/13896/da8caf5a11764f528e857df380875aa4_moov1_m.jpeg
    listing-photo-8isQeaUTqQwn-o6brt0FjfuMPanNFWi5ZGS41li-BL4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1097/13896/7346639713b24054b4055d8ce97fa549_moov6_m.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    13896

    Wafer Sizes:

    Unknown

    Vintage:

    2010

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.
    Documents

    No documents

    Similar Listings
    View All
    ASM TWIN EAGLE XTREME
    ASM
    TWIN EAGLE XTREME
    BondersVintage: 2010Condition: UsedLast Verified: Over 60 days ago
    ASM TWIN EAGLE XTREME
    ASM
    TWIN EAGLE XTREME
    BondersVintage: 2011Condition: UsedLast Verified: Over 60 days ago