Description
Die bonderConfiguration
No ConfigurationOEM Model Description
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.Documents
No documents
ASM
ISLinDA
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65363
Wafer Sizes:
Unknown
Vintage:
2016
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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ASM
ISLinDA
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65363
Wafer Sizes:
Unknown
Vintage:
2016
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Die bonderConfiguration
No ConfigurationOEM Model Description
ASMPT's ISLinDA is a cutting edge 12"; die bonder for stacked and thin die bonding capability. It is excellent in thin die handling employing various patented thin die ejecting systems. It can achieve high throughput and accuracy by a dual head system and a powerful vision system.Documents
No documents