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The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrateDocuments
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ASM
IS868LA2
Verified
CATEGORY
Bonders
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76359
Wafer Sizes:
Unknown
Vintage:
2010
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ASM
IS868LA2
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76359
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM IS868LA2 is a die bonder machine used in the semiconductor industry for attaching semiconductor chips to a substrateDocuments
No documents