Description
working condition No missing partsConfiguration
No ConfigurationOEM Model Description
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.Documents
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ASM
EAGLE 60AP
Verified
CATEGORY
Bonders
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65478
Wafer Sizes:
Unknown
Vintage:
2006
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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ASM
EAGLE 60AP
Verified
CATEGORY
Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65478
Wafer Sizes:
Unknown
Vintage:
2006
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
working condition No missing partsConfiguration
No ConfigurationOEM Model Description
The ASM Eagle 60AP is a cutting-edge wire bonding machine that revolutionizes wire bonding technology. It is capable of handling 30µm bond pad pitch, demonstrating proven volume production of pad pitches as low as <45µm. The machine is designed to excel in ultra fine pitch wire bonding applications, maintaining a leading position in the industry. The Eagle 60AP is specifically engineered to tackle the challenges of emerging advanced packaging wire bonding, offering unmatched productivity, performance, and quality for a wide range of products and specifications.Documents
No documents