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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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ROCK 08

Overview

Wafer Bonder The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range. The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump. Technical Features: In-situ alignment (visible and IR illumination) with 1pm accuracy Chamber pressure from 10-8 bar range to 2 bar absolute Wafer separation up to 30mm (multi stack bonding possible) Independent platen temperatures up to 560°C Radical activation for low temperature direct bonding Bonding forces up to 40 kN Anodic bonding voltage up to 2.5 kV Triple stack anodic bonding UV curing option NIR camera option

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