Wafer Bonder
The Rock Aligner Bonders are designed for bonding under Ultra High Vacuum conditions, in the 10-8 mbar range.
The Rock systems offer the same aligning and bonding capabilities as the AWB systems, and the UHV vacuum levels are achieved through the use of fully-integrated Cryopump.

Technical Features:
In-situ alignment (visible and IR illumination) with 1pm accuracy
Chamber pressure from 10-8 bar range to 2 bar absolute
Wafer separation up to 30mm (multi stack bonding possible)
Independent platen temperatures up to 560°C
Radical activation for low temperature direct bonding
Bonding forces up to 40 kN
Anodic bonding voltage up to 2.5 kV
Triple stack anodic bonding
UV curing option
NIR camera option

APPLIED MICROENGINEERING LTD (AML) 

ROCK 08

Wafer to Wafer Bonding - Fully auto-process, with manual wafer loading

APPLIED MICROENGINEERING LTD (AML)

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