Description
Inline die and copper clip attach with reflow oven curing – 3 complete lines. The entire line consist Die attach D1, Die attach D2, IMBR (copper clip attach) and reflow oven. All the D1, D2 and IMBR machine has fully refurbished. The oven and filter is brand new machine.Configuration
No ConfigurationOEM Model Description
The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc. The clip-attach process replaces the wire connection between die and the leads with a solid copper bridge where no wire bonder is longer needed.Documents
No documents
KULICKE & SOFFA (K&S) / ALPHASEM
EASYLINE 8033
Verified
CATEGORY
Bonders
Last Verified: 24 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
60535
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KULICKE & SOFFA (K&S) / ALPHASEM
EASYLINE 8033
CATEGORY
Bonders
Last Verified: 24 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
60535
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Inline die and copper clip attach with reflow oven curing – 3 complete lines. The entire line consist Die attach D1, Die attach D2, IMBR (copper clip attach) and reflow oven. All the D1, D2 and IMBR machine has fully refurbished. The oven and filter is brand new machine.Configuration
No ConfigurationOEM Model Description
The Alphasem Easyline 8033 clip-attach system is the answer for high-speed clip-attach applications for power devices such as SOD, SMA, DPAK, TO 220, etc. The clip-attach process replaces the wire connection between die and the leads with a solid copper bridge where no wire bonder is longer needed.Documents
No documents