Overview

Synapse™ Si adopts a compact design that halves the footprint, and also realized high throughput at the same time. By extending additional block, productivity per footprint can be further improved. Synapse™ Si is a successor model of Synapse™ S, a wafer fusion bonding equipment widely used in 300mm CMOS image sensor mass production lines. Compared to conventional Synapse™ S, alignment accuracy has been improved. Improved throughput based on Litius Z frame, bonding of silicon oxide and Cu capable, 3 alpha per 100nm accuracy.