Description
No descriptionConfiguration
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEM Model Description
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.Documents
No documents
EVGroup (EVG)
EVG805
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55578
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG805
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
55578
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.OEM Model Description
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.Documents
No documents