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EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
  • EVGroup (EVG) EVG805
Description
No description
Configuration
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.
OEM Model Description
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
Documents

No documents

CATEGORY
Bonder/Debonder

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

55578


Wafer Sizes:

Unknown


Vintage:

2000


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

EVGroup (EVG)

EVG805

verified-listing-icon
Verified
CATEGORY
Bonder/Debonder
Last Verified: Over 60 days ago
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listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/ec8ac910251e4475804017c8d86718df_2cd3241547a247dabb728785a79c84f41201a_mw.jpeg
listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/cd6cad19836343479056cc34e88a9df3_ec227f24834546a4a09d41ac38655a7e1201a_mw.jpeg
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listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/e077e4fc5f004630ab9004b768f9a27a_6093ecb0a7fc4615b82de61435276f4c1201a_mw.jpeg
listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/560d106bd93c484a85c0bfcd0649aac5_3b0a84ceebc347cc8de49680e9d6a8f31201a_mw.jpeg
listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/bab5279275f24df99b0e0d2d412ae5e2_59c02db1f2e54e7a832d0147aa788c861201a_mw.jpeg
listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/104ba84bc2044b36b6ddf67f28b807b5_f450b88b6c68474bafee3be09427828b1201a_mw.jpeg
listing-photo-a215076998bd4267bb52126c7b97ea7f-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1186/a215076998bd4267bb52126c7b97ea7f/1e6a76a67d6c462ebeb4f3bd9873b6ed_3a312963a24340d898aa33e258f8c2f51201a_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

55578


Wafer Sizes:

Unknown


Vintage:

2000


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
-SOI version( de bonder or temporary bonder) -Load, unload stations, Genmark robot, cleaning station, bonding Station and inspection.
OEM Model Description
The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
Documents

No documents