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EVGroup (EVG) EVG805
    Description
    Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available
    Configuration
    No Configuration
    OEM Model Description
    The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
    Documents

    No documents

    EVGroup (EVG)

    EVG805

    verified-listing-icon

    Verified

    CATEGORY
    Bonder/Debonder

    Last Verified: Today

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    144932

    Wafer Sizes:

    8"/200mm

    Vintage:

    2010

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
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    EVGroup (EVG) EVG805

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    EVG805

    Bonder/Debonder
    Vintage: 2010Condition: Used
    Last VerifiedToday
    EVGroup (EVG) EVG805

    EVGroup (EVG)

    EVG805

    Bonder/Debonder
    Vintage: 2000Condition: Used
    Last VerifiedOver 60 days ago

    EVGroup (EVG)

    EVG805

    verified-listing-icon
    Verified
    CATEGORY
    Bonder/Debonder
    Last Verified: Today
    listing-photo-14f6feb16f3c44e69a4b267a07b57dec-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91112/14f6feb16f3c44e69a4b267a07b57dec/637e96534fea4f408e89f2d1c1150c4d_7a4fca12f79041ee886bf259d017b8041201a_mw.jpeg
    listing-photo-14f6feb16f3c44e69a4b267a07b57dec-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91112/14f6feb16f3c44e69a4b267a07b57dec/1984d9c78a5941f5ae6836097964b7fa_9d506ca64b6048388b58c4d5d38a03cc_mw.jpeg
    listing-photo-14f6feb16f3c44e69a4b267a07b57dec-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91112/14f6feb16f3c44e69a4b267a07b57dec/29e686e8155442baa49c216a9a74fadb_bda9b7e8a3da4956ae98c3af32cf7d13_mw.jpeg
    listing-photo-14f6feb16f3c44e69a4b267a07b57dec-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/91112/14f6feb16f3c44e69a4b267a07b57dec/e25ddd5b19e14ce4a1cc114f79760d9a_d48090a0ae37414c8a6a357fc0bbce431201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    144932

    Wafer Sizes:

    8"/200mm

    Vintage:

    2010

    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Semi-automatic Thermal Slide De-Bonder Thermal slide-off debonding Bottom IR lamp heating Chuck sizes: 8 inch Suitable for temporary bonded wafer stacks Recipe-controlled process Real-time process monitoring/logging (force, temperature, and position) 8 inch end effector available
    Configuration
    No Configuration
    OEM Model Description
    The EVG805 is a semi-automated system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carrier wafer and an intermediate temporary bonding adhesive. The tool either supports thermal or mechanical debonding. The thin wafer can be unloaded on a single substrate carrier for safe and reliable transport between tools.
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) EVG805

    EVGroup (EVG)

    EVG805

    Bonder/DebonderVintage: 2010Condition: UsedLast Verified:Today
    EVGroup (EVG) EVG805

    EVGroup (EVG)

    EVG805

    Bonder/DebonderVintage: 2000Condition: UsedLast Verified:Over 60 days ago