ODIN is a fully automated high-resolution AOI tool for the optical inspection of patterned and non-patterned wafers, their edges and back sides. All these features are seamlessly integrated in one single platform. Advanced 2D- and 3D metrology options for CD, OVL, VIA and film thickness and additional modules for super-fast macro scans (WOTAN) and edge inspection (THOR) enable true all-side wafer inspection and characterization.

UNITY SEMICONDUCTOR / HSEB

ODIN

WOTAN is a fully automated, recipe-free, high-speed AOI tool for simultaneous front and back side inspection. It automatically detects macroscopic defects based on a wafer-to-wafer comparison. Key application is high throughput process monitoring and tool control . Easy-to-read instant result display options allow short correction cycles.
WOTAN is available stand-alone and in combination with edge inspection modules (THOR).

WOTAN

MMT 300

The TMAP NST is a non contact full field metrology solution based on optical microscopy enabling surface topography measurements at the nano scale.

UNITY SEMICONDUCTOR / HSEB

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