Veeco Instruments Inc. a global leader of advanced thin film etch and deposition process equipment, acquired Ultratech, Inc. a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs.


The XLS 193nm (small field) system is a DUV tool used for advanced research and development semiconductor materials and processes.

VEECO / ULTRATECH

XLS 193nm

The XLS 9800 and XLS 9900 provide i-line and DUV wavelength capabilities and are designed to meet TFH customers' requirements for shrinking geometries on their critical layers.

XLS 9900

XLS 9800

TITAN 300

TITAN 200

Superfast 4G system can be upgraded to a Superfast 4G+.

SUPERFAST 4G

LSA100

1700 ABS are used to expose the Air Bearing Surface (ABS) pattern.

1700 ABS

The Ultratech Star 100 is a type of 1X stepper that provides improved alignment for device features that are larger than 0.8 micrometers. It is intended to replace contract printers and other systems by offering better alignment capabilities and more advanced networking features. The Star 100 can handle wafers that range in size from 75 millimeters to 200 millimeters, and it is marketed as an affordable lithography solution for high-volume fabs that produce low-cost power ICs, linear chips, and application-specific ICs. The system is based on Ultratech’s 1500 stepper platform and uses a cutting-edge machine vision system (MVS) for pattern-recognition alignment. It also has a new PC-based system controller and operator interface. The MVS alignment system includes new software that allows it to align to difficult product layers, eliminating the need for large scribe lines.

STAR 100

Extends capabilities to much smaller submicron patterns used for pole trimming.
0.8mm

1800

2000GH

Veeco’s LSA101 System is the preferred technology for high-volume manufacturing of advanced logic devices from the 40nm to 14nm nodes. 

LSA101

The Ultratech 1600 DSA, also known as the NanoTech 160, is a wafer stepper system that can align wafers on both the front and back sides. It has non-contact lithography capabilities and can place multiple lithography layers on a single reticle. It also has off-axis MVS with focus and illumination controls, high wafer plane irradiance, and can be easily integrated with existing processes. Its compact system footprint makes it an ideal choice for high-volume chip production and prototyping.

1600 DSA

1000

UltraBeam model V2000 electron beam pattern generation system based on vector-scan technology for use in the development and production of photomasks for the IC industry.

V2000

1014

TITAN I

SATURN 300

1100R

SATURN 200

The LSA201 is our latest LSA product offering, which enables full-wafer ambient control processing targeted for sub-20nm nodes.


LSA201

TITAN 1.1

The Ultratech 1700, also known as the Ultratech Model 1700 MVS Machine Vision System, is one of Ultratech’s most sophisticated tools for air bearing surface patterning applications. It incorporates an advanced machine vision system and customized software specifically designed for rowbar level processing, allowing it to recognize and automatically align to preexisting features without the need for special targets. The Model 1700MVS is the world’s most widely used thin film head (TFH) lithography tool for high-volume manufacturing, thanks to its design simplicity, reliability, ease of operation and maintenance, low initial investment cost, and low operating costs. 

1700

The AP300L targeted cost sensitive customers that do not need all of the advanced capabilities associated with our flagship product offering, such as the low end outsourced semiconductor assembly and test ("OSAT") market segment.

AP300L

The Ultratech AP300W is a type of stepper lithography system that belongs to the AP200/300 series of systems. These systems are built on Veeco’s Unity Platform™, which is customizable. The AP300W and other systems in the series are known for their excellent overlay, resolution, and side wall profile performance. They are also highly automated and cost-effective. The AP300W is particularly well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also includes many features that are specific to certain applications, which help to enable next-generation packaging techniques. Some of these features include enhanced handling of warped wafers, dual side alignment, and optical focus.

AP300W

TITAN 1.2

1900

SATURN II

The Prisma-ghi was developed as a lower cost, low volume/R&D bump stepper.

PRISMA-ghi

PC 603

LSA201HP

TITAN III

Reduction Stepper 
The XLS 7800 is a DUV version of the tool, utilizing a DUV wavelength of 248nm.

XLS 7800

Wafer Inspection Systems
The Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield. At advanced technology nodes, variations in stress and distortion on a wafer can have a significant impact on device performance and yield. Based on CGS technology, we believe that our Superfast 3G provides the industry's highest wafer resolution for the targeted applications and measures over 800,000 points of data per 300mm wafer. The Superfast 3G is unique in that it collects data from the whole wafer simultaneously, providing significantly higher data density without the need for targets or pads.

SUPERFAST 3G

The Mercury XLS 248 is a DUV (248nm) reduction stepper providing a minimum resolution of 0.25 microns for selected semiconductor applications requiring sub-0.35 micron resolution.

XLS 248

1100S

Superfast 4G+ in-line, 3D topography inspection system for the optical-based inspection of advanced 3D memory and logic devices. Based on patented coherent gradient sensing (CGS) technology, this system provides the industry’s highest productivity, with throughput at 150 wafers per hour, and lowest cost of ownership. Generating up to 3 million points of data per wafer, Superfast 4G+ is able to fully map a wafer out to its edge. 

SUPERFAST 4G+

Ultratech Stepper Inc. has launched the Model 1500MVS, the latest addition to its well-established Model 1500 Lithography Series. The Model 1500MVS incorporates Ultratech’s machine vision system (MVS), which provides enhanced alignment flexibility that is not achievable using traditional alignment methods. As a pattern recognition alignment system, the MVS eliminates the need for larger scribe lines between dies to accommodate dedicated alignment targets, resulting in an increase in the number of net die-per-wafer. According to Ultratech, the Model 1500’s MVS capability enables it to recognize targets produced for any other lithography tool, thereby eliminating the need for dedicated targets and facilitating the implementation of mix-and-match strategies.


1500 MVS

2700

SATURN III

TITAN 4700

The Saturn or Titan stepper is used in conjunction with electroplating to produce a pattern of bumps, or metal connections, on the bond pads of the die for flip chip devices.

SATURN I

A novel dual beam technology extending the system's capabilities to lower processing temperatures. The LP dual beam is targeted to enable middle-of-line (MOL) applications such as nickel silicide formation.


LSA101LP

1000W

TITAN 4035

The ULTRATECH Saturn Spectrum 300E is a type of stepper developed by Ultratech Stepper Inc. to meet the increasing demand for thick photoresist exposure in 300mm bump applications. It is part of Ultratech’s advanced-packaging product line. The Saturn Spectrum 300E is designed to provide consistent exposure doses on wafer substrates, resulting in faster production times and fewer issues with non-scalable patterns. Its low numerical aperture (NA) and broadband illumination spectrum allow for a more uniform aerial image through the depth of ultra-thick photosensitive materials, compared to steppers with higher NAs and narrower bandwidths.

SATURN SPECTRUM 300e

**PARTS**

V100

LSA201LP

The Saturn Spectrum 300e2 is a flagship product from the Saturn company that supports 300mm bump manufacturing. It provides broadband exposure (g, h, and i-line) and is used in conjunction with electroplating to produce a pattern of bumps or metal connections on the bond pads of the die for flip chip devices. This technology is essential for creating high-quality and reliable connections in electronic devices. 

SATURN SPECTRUM 300e2

To extend the system's capabilities to longer dwell times. The HP dual beam temperature profile has the potential to open up new applications, such as annealing out implant-related defects with minimal dopant diffusion.


LSA101HP

XLS 157nm (small and mid field) system is a DUV tool used for advanced research and development semiconductor materials and processes.

XLS 157nm

LSA100A

The Ultratech Saturn Spectrum 3 is a stepper and scanner system utilized in the production of semiconductor devices. It is capable of manufacturing wafers in sizes ranging from 4 to 8 inches. Ultratech also offers an updated version of this system, the Saturn Spectrum 3e, which incorporates an enhanced machine vision system (MVS) that includes the PatMAX architecture. The Saturn Spectrum 3e also boasts improved illumination, with a wafer plane irradiance of 1900 mW/cm2, resulting in shorter exposure times.

SATURN SPECTRUM 3

The UltraStep 1500 is a big field 1:1 projection stepper system that exposes reticle images onto wafers of various sizes in a step-and-repeat manner. It has a fine line resolution of 1.0um standard and 0.8um optional, and tight overlay accuracy. The UltraStep 1500 features a larger exposure field, an electronic focus system, electronic target detectors, 944 servo boards, and a cast illuminator with upgraded optics. These features allow for large die exposure, increased throughput, more accurate and repeatable substrate positioning, simultaneous independent target scans, more stability during movement and exposure, and lower exposure field uniformity. The UltraStep 1500’s low cost and compact design make it an ideal choice for chipmakers upgrading from older equipment, and it can be integrated with other higher resolution steppers to maximize throughput while minimizing production costs.

1500

The Ultratech Saturn Spectrum 3e is a lithography stepper from Ultratech Stepper Inc. that is designed for high-volume flip-chip (bump) and wafer-level packaging manufacturing. It features an improved machine vision system (MVS) with the addition of the PatMAX architecture, which is a pattern recognition-based alignment system that eliminates the need for dedicated targets and simplifies integration with existing processes. The Saturn Spectrum 3e also has improved illumination, providing an increased wafer plane irradiance of 1900 mW/cm2, resulting in decreased exposure times and improved productivity. Additionally, the tool incorporates an automated field aperture changer to enable faster reticle field size changes, as well as an automated broadband ghi-line filter changer, allowing automated switching between either g, h or i-line exposure capabilities. 

SATURN SPECTRUM 3e

The UltraTech Saturn Spectrum 300 is a stepper system used in the fabrication of semiconductors. It can handle wafers that are between 8" and 12" in size and has a resolution of 2.0 microns. The system is equipped with a robotic wafer handler, an environmental chamber, and a reticle library, as well as a light pipe that measures 44 x 26.7 mm. The illuminator can be either 1000w or 1200w and the lens alignment is automatic with enhanced global alignment. Additionally, the UltraTech Saturn Spectrum 300 features an air probe focus detector, a 3-point focus detector, and a linear motor for the X and Y stage. It also includes an MVS pattern recognition system, a closed-loop exposure dose controller, a vibration isolation system, auto-uniformity, and dynamic focus. The system is SECS II compatible and has bottom-side prism protection pellicle, dual flip aperture broadband, an intensity of 1650mW, uniformity of 7%, and a DOF of 2µm.

SATURN SPECTRUM 300

The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.

AP200

The model 2244i and Saturn Wafer Stepper feature an i-line illumination specification that is designed to make them compatible with advanced i-line reduction steppers.

2244i

The 4700 model provides manufacturers the ability to print rowbars with a single exposure. This process enhances both yields and magnetic recording head performance. Rowbars are structures in read/write heads of hard drives. The ability to print these with a single exposure can significantly speed up the manufacturing process and improve the quality of the end product. This model represent advanced tools in the field of semiconductor and microdevice manufacturing, offering increased efficiency and precision. This is used in industries where microfabrication is key, such as in the production of microprocessors, memory chips, and hard drives.

4700

The Sapphire 100, was developed for the manufacturing of high-brightness light-emitting diodes (HBLEDs). The Sapphire 100 system is intended to assist Ultratech’s customers in meeting the increasing demand for illumination products that utilize HBLED technology. Additionally, the Sapphire 100 system incorporates Ultratech’s patented Machine Vision System (MVS), which provides enhanced alignment flexibility and significant benefits over traditional alignment methods. The system is suitable for use in a variety of applications, including HBLEDs, semiconductor fabrication, nanotechnology, and advanced packaging (through the AP series).

SAPPHIRE 100E

The Sapphire 100 is also based on the 1000 Series platform, with additional features developed specifically for HBLED lithography applications. HBLED manufacturing requires special substrate handling capabilities for the small diameter sapphire and silicon carbide substrates used to manufacture the LED devices for display backlighting and general lighting applications. For HBLED applications, we believe our Sapphire 100 stepper offers depth of focus, productivity and yield improvement advantages over competitive product offerings.


SAPPHIRE 100

UltraMet 100

The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.

AP300

XLS 7500

Mercury XLS 200 is an i-line reduction system with a minimum resolution of 0.35 microns, providing a high resolution i-line reduction stepper option for selected semiconductor markets.

XLS 200	

The Ultratech TITAN II is a type of wafer stepper that belongs to the Ultratech series of lithography systems. It is capable of handling wafers that range in size from 4 inches to 8 inches, and it has a reticle size of 5 x 5 inches. The system has a projection ratio of 1:1, a lens resolution of 2 micrometers, and a field size of 44 millimeters by 22 millimeters. Additionally, the TITAN II includes a reticle library that has 12 slots and a bar code reader. It also has a stage with a monolithic structure and linear motor drive. The system is equipped with active air isolation to control vibrations and has global alignment accuracy of 120 nanometers in just 3 seconds. The imaging and lens system can achieve feature sizes as small as 2.0 micrometers, with lens distortion of 120 nanometers and colinearity of 80 nanometers. The maximum image area is 55 millimeters by 18 millimeters, and the exposure spectrum is broadband, ranging from 390 nanometers to 450 nanometers. The wafer plane intensity is greater than 1200 milliwatts per square centimeter, with uniformity of 2.0%.

TITAN II

The UltraTech 1100 is a stepper system that is used to transfer reticle images onto wafers. It can handle wafers that are between 3" and 6" in size and has a resolution of 1.0 microns. The system uses a broadband alignment system that includes both “G” and “H” lines and has the option for either WAS key and target automation or an intelligent autoloader. Additionally, the UltraTech 1100 features air probe edge switches and is equipped with an HP 362 computer that includes a hard disk. 

1100

CGS-300

PC 602

The Ultratech 4700 is a stepper model that is capable of patterning features on rowbars utilizing an alternate alignment system called the Machine Vision System (MVS). The model 6700 extends the capabilities of the model 4700 into the submicron range by utilizing i-line exposure. In addition, the company provides three steppers, including the model 1700 MVS and 1700 ABS, which are used to expose the Air Bearing Surface (ABS) pattern, and the model 1800, which extends capabilities to much smaller submicron patterns used for pole trimming.

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VEECO / ULTRATECH

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XLS 193nm

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