Overview

Wafer Inspection Systems The Superfast 3G, which provides the flexibility to address a wide range of applications including improved overlay control and enhanced yield. At advanced technology nodes, variations in stress and distortion on a wafer can have a significant impact on device performance and yield. Based on CGS technology, we believe that our Superfast 3G provides the industry's highest wafer resolution for the targeted applications and measures over 800,000 points of data per 300mm wafer. The Superfast 3G is unique in that it collects data from the whole wafer simultaneously, providing significantly higher data density without the need for targets or pads.