The Oxford Plasmalab80Plus is a compact plasma processing system that can perform high-quality plasma-enhanced chemical vapor deposition (PECVD) of materials such as SiOx, SiNx, and SiOxNy. This system is suitable for a variety of applications, including the creation of photonics structures, passivation, and hard masks. The Plasmalab80Plus has a small footprint and offers versatile etch and deposition solutions with easy open loading. It is simple to install and operate, while still delivering excellent process quality. The open load design allows for quick wafer loading and unloading, making it ideal for research, prototyping, and low-volume production. The system also enables high-performance processes through optimized electrode cooling and precise substrate temperature control.

OXFORD

PLASMALAB 80 PLUS

The PlasmaPro 800Plus is a plasma etch and deposition solution that offers a large area for processing. It features an open loading design, making it easy to use and convenient to site, all while maintaining a compact footprint. The system is capable of handling full 300mm wafers or large batches of 43 x 50mm (2”) wafers, thanks to its 380mm or 460mm diameter table. This makes the PlasmaPro 800Plus a well-proven market-leading product that offers full production solutions without compromising on process quality. 

PLASMALAB 800 PLUS

The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small pieces

PLASMALAB 100 PECVD

OPAL

The Oxford PLASMALAB 133 ICP 380 is a type of Ion Couple Plasma Etching System that features a 380 ICP Source. This system is designed with a manual load lock and a ceramic clamp style. It comes with an Alcatel Turbo pump and controller, a VAT Gate Valve and PM5 controller, an Endpoint Detector, and an RF power supply with match work and tuner. Additionally, it has eight Mass Flow Controllers.

PLASMALAB 133 ICP 380

The Oxford Plasmalab 133 is a system used for plasma etching through a process called Reactive Ion Etching (RIE). This refurbished system is designed for GaN etching and has a platen that measures 330mm. It has an RF power of 600W at a frequency of 13.56MHz and features a water-cooled electrode that can operate within a temperature range of 10°C to 80°C. The system also includes a load lock with a turbo pump and an end-point detection system that utilizes Verity Optical emission spectroscopy within the range of 200-800nm. The gas pod of the system has six lines, including mass flow controllers for gases such as Ar, CL, BCL3, and N2O.

PLASMALAB 133

The PlasmaPro NGP1000 from Oxford Instruments is a tool that uses plasma etching and deposition to deposit layers of SiO2 and SiNx. It is part of the PlasmaPro NGP1000 HBLED series of tools. The system features a large electrode and a specially designed showerhead, which allows it to accommodate up to 61 x 2”, 15 x 4” or 7 x 6” wafers at once. This tool is specifically designed to provide exceptional advantages for manufacturers of HBLEDs.

PLASMAPRO NGP1000

PLASMALAB 100 DRY / PLASMA ETCH

PLASMALAB 100 ICP 380

PLASMALAB 400

MAXXI 5

X-MAX 80

100 180 ICP

PLASMALAB 133plus

The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.

PLASMAPRO 100 PECVD

Inca X-Act 

MODEL 10

Plasmalab 100 ICPCVD

Multi-Wafer Hydride Vapor Phase Epitaxy (HVPE) Reactor

CrystalFlex

The Ionfab 300 Plus from Oxford Instruments is a tool that uses ion beam technology for etching and deposition. It is part of the Ionfab 300 series and is designed to be versatile for multiple applications. The system has several hardware options, including open load, single substrate load lock, and cassette to cassette. It can also be configured to work with other plasma etch and deposition tools, either with a single wafer loadlock or cluster wafer handling. The Ionfab 300 Plus has several modes of operation, including ion beam etching (IBE), reactive ion beam etching (RIBE), chemically assisted ion beam etching (CAIBE), reactive ion beam deposition (RIBD), ion beam sputter deposition (IBSD), and ion assisted sputter deposition (IASD)

IONFAB 300 PLUS

PLASMAPRO 100

INCA X-SIGHT

The Oxford Instruments Plasma Technology Ionfab 300 (including the 300 Plus version) is a compact, high-precision ion beam system designed for research, pilot production, and microfabrication.

Ionfab 300

FlexAL II

MFP-3D Origin

100 PLUS

An ultra-high resolution, large-sample atomic force microscope

Jupiter Discovery

The MFP-3D Origin+ features high performance and extensive capabilities at a price competitive with most low-cost AFMs. The MFP-3D Origin+ is an extremely versatile and high performance research AFM ready for almost any field of research. It features the same core performance as the MFP-3D Origin but includes support for the complete range of innovative MFP-3D accessories. This makes it a tremendous value at a low price point where other AFMs often lag with lackluster performance and highly limited feature sets.

MFP-3D Origin+

90 PLUS RIE

Deep Reactive Ion Etching (DRIE) applications

PlasmaPro 100 Estrela

7421

X-STRATA 980

 Opal-PEALD

MFP-3D Infinity

CMI 950

CMI 900

The FlexAL atomic layer deposition (ALD) system offers a broad range of optimised high-quality plasma ALD and thermal ALD processes with maximum flexibility in precursors, processes gases, and hardware configuration within a single process chamber.

- Remote plasma for low damage plasma ALD combined with thermal ALD in one deposition chamber
- RF biased electrode option available for control of film properties
- Industry-standard cassette to cassette handling for higher throughput
- Maximum flexibility in the choice of precursors, process gases, hardware features and options
- Optimised to maintain low-damage, high-quality substrates
- Removable liners allow for easy chamber maintenance
 -Low temperature to enable high-quality deposition on temperature-sensitive surfaces

FlexAL

X-MAX 80T

Starting Cypher model with ultra-high resolution, fast scanning, and a full range of modes

OXFORD

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