CANON acquired NEC Machinery and became CANON Machinery which focuses on: Die bonders, die sorters, inspection equipment, mounters, cure furnaces on the semiconductor side of the business.


A LED package compatible die bonder realizing both high performance and reduced total cost of ownership (TCO).

CANON / NEC

BESTEM-D320

Epoxy die bonder
    Small die, paste bonding, twin stamping system
    LED / PLCC, LGA

BESTEM‐D321

Epoxy die bonder
   Small die, paste bonding, twin stamping system
   LED / PLCC, LGA

BESTEM-D321 plus

BESTEM‐D531t

BESTEM-D10Fx

BESTEM-D02

BESTEM-D02H

BESTEM-D10Sp

CPS-100 VX

A solder die bonder compatible with high-quality, high-power devices, such as Dpak, To220, To3p and IGBT.

BESTEM-D03Hp

Recognition setting. 
BESTEM-D01  die bonder for LEDs and small pin ICs

BESTEM-D01R	

CAP-3500	

BESTEM D01Np

BESTEM-D11

CPS-3000

BESTEM-D03

Clip bonder for clip bonding packages with compatibility, such as SOT, SOP and QFN.

BESTEM-C310

High-speed, high-accuracy die bonder for 8 inch wafer IC･LSI

BESTEM-D310

Wafer Size: 6/8/12 inch
This machine picks up only quality die from diced wafers, A die sorter that is aligned and stored in the tray.

BESTEM‐S500

This machine picks up only quality die from diced wafers, organizes and stores them on the tray. Equipped with full digital control bonding head with high-speed potential, records location data for each unit based on work data, various teaching functions and HMI bonding facilitate high productivity, ease of adjustment, stability and flexibility.

BESTEM-S300

CAP-400Ⅱ

CAP-300Ⅱ	

High-speed, high-accuracy die bonder for IC and LSI compatible with 12 inch wafers.
Wafer Size: Max φ12 inch


BESTEM-D510

BESTEM-D10R

BESTEM-D01

Epoxy die bonder
    Small die, paste bonding, twin dispensing system
    IC, Sensor / QFN, CSP

BESTEM‐D311

1995 Ultra-High-Speed, Stable Operation
We began development of the CPS-550VX to meet needs for greater speed and smaller chips, with the goal of achieving 12000 UPH (units of wafers per hour). 

CPS-550VX

High performance flip chip die bonder for flip chip bonding compatible with 12 inch wafers.

BESTEM‐D511f plus

BESTEM‐D540

Epoxy die bonder
Small die, paste bonding, twin dispensing system
IC, Sensor / QFN, CSP

BESTEM‐D311 plus

This device can be used from power discretes to power ICs and IGBT modules. For power devices that require high bonding quality, including automotive applications Die bonder for solder joining process.

BESTEM-D340

CPS-400F

CPS-100

Wafer Size: Max φ12 inch
Bonding Application: Dispense
Bonding Accuracy: High accuracy

CANON / NEC

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BESTEM-D320

BESTEM‐D321

BESTEM-D321 plus

BESTEM‐D531t

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