BESTEM-D510
Overview
High-speed, high-accuracy die bonder for IC and LSI compatible with 12 inch wafers. Wafer Size: Max φ12 inch
Active Listings
0
Services
Inspection, Insurance, Appraisal, Logistics
Top Listings
- No products found
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Messages
Messages
Messages including contact info may not be shared. We scan, review, and reserve the right to remove sensitive information from all messages to prevent fraud and policy violations.All messages subject to review, review our policy for more info.
6" Fab For Sale from Moov - Click Here to Learn More
