Meco manufactures and supplies continuous plating systems to suit the electronics industry. Over the years, these systems have established an international reputation for high performance, outstanding reliability, top quality and unbeatable economy. This is the result of over 30 years of experience in designing, manufacturing and most important plating. Furthermore, Meco supplies, installs and services its plating systems in any industrialized country, thanks to an organisation comprising international sales and service centers. Meco offers more than just top quality, high reliable plating systems. Meco also provides advice and support on installation (turn key), production start-up and quality control facilities, as well as all required process chemistry, hardware and accessories.

BESI / MECO

EDF+EPL2400S

Meco Flex Antenna Plating System (FAP): a unique cost-effective additive process for RFID antenna manufacturing, Flexible PCB and Copper Clad Laminate (CCL).
Substrate width 650 mm

FAP 650

With an installed base of over 350 EDF/EPL systems, Meco has set the industry standard for leadframe solder plating. The system is fully customized to your specific needs and is a green solution, with low power consumption and minimal chemical usage. The Meco Electro DeFlash and Electro Plating Line are designed for the future and are capable of handling any kind of leadframe product. Any leadframe size up to 110 x 315 mm can easily be handled on the Meco EDF/EPL.

EDF/EPL

The Meco Panel Plating Line (PPL) electroplates a sub-micron layer of Copper, Indium and Gallium onto a glass substrate to form the absorber layers of a CIGS thin film solar cell. Electrochemical deposition offers manifold advantages compared to vacuum deposition techniques: a nearly 100% efficient utilization of Cu, In and Ga metals, no vacuum conditions required, a smaller footprint and lower facility requirements! To further develop high efficiency CIGS solar cells by electrochemical deposition of Cu, In and Ga Meco is working together with the Solliance Initiative.

For next generation silicon solar cells where the SiNx layer has been opened by laser ablation the Meco Direct Plating Line (DPL) can plate a dense layer of Ni-Ag, Ni-Cu-Ag or Ni-Cu-Sn onto high-ohmic emitters. This results in an efficiency increase up to 1% (abs.) and a tremendous cost reduction (US$/Wp) as no Ag paste is needed anymore for the frontside metallization.

Meco Flex Antenna Plating System (FAP): a unique cost-effective additive process for RFID antenna manufacturing, Flexible PCB and Copper Clad Laminate (CCL).
Substrate width 430 mm

FAP 430

To electroplate the absorber (precursor) layers of a flexible CIS or CIGS thin film solar cell, Meco offers Reel-to-Reel (R2R) plating equipment. 
Based on our reel-to-reel continuous selective plating technology, Meco designs and builds custom-made reel-to-reel plating solutions for the production of CIS and CIGS cells. A sub-micron layer of Indium on Copper is plated or plating of Gallium Copper and Indium can be done onto a substrate with the highest uniformity possible. Also here it is key to achieve the highest efficiency and selectivity. Traditionally the deposition of the metal layers on thin film solar cells is done by means of vacuum deposition. As opposed to the Meco system, these systems require extensive vacuum systems and depending on configuration take a large amount of factory space.The Meco R2R Solar Line is developed to plate the precursor layer on the seed layer of flexible substrates such as steel, PET or kapton. Since there is no standard substrate dimension in the thin film solar industry every project will be tailored to customer specific requirements.

RTR Solar

Meco CPL: More Power Out of Your Cell at a Lower Cost! The Meco CPL is based on the robust and proven concept of the Meco EPL which has, with more than 350 machines installed worldwide, built a reputation in the semiconductor world for leadframe plating applications.

Meco Reel-to-Reel Ag Spot (RTR Ag): Meco's solution for high speed spot plating with exceptional flexibility. Meco's spot technology makes high plating speeds possible (roughly 3 times faster than for step and repeat systems). Because the leadframe moves continuously around and engages with the spot-tool, there is no "dead" time as seen in the step and repeat system. For high-speed silver spot plating you can reach up to 156 micron per minute based on 250 A/dm2, depending on spot configuration. In most high-speed silver spot lines with line speeds up to 12 m/min a tandem spot unit is sufficient to reach the common silver specification of 4 microns.

RTR Ag

Meco Flex Antenna Plating System (FAP): a unique cost-effective additive process for RFID antenna manufacturing, Flexible PCB and Copper Clad Laminate (CCL).
Substrate width 330 mm

FAP 330 Ecoline

Meco's Solution for Accurate Silverspot Plating Where Mechanical Masking Becomes Impossible!
In general, spot tolerances of ± 125 micron in x and y direction can be reached by mechanical masking systems like Meco's patented spot tool technique. The disadvantage of mechanical masking is that you often get bleed-out of silver on the cutted edges of the leads as shown. Undesirable metal coating on these functional areas may result in poor adhesion of the mould compounds, while any silver extending beyond the package after molding may cause short circuiting among the leads as result of silver migration. Looking at the trends in leadframe design, ongoing attempts towards further miniaturization are observed. These developments result in a high lead density, thinner leadframes and packages. Such complicated and fragile leadframes are not stamped in reel to reel form, but more frequently in etched cut strips. It also requires a higher accuracy of silver spot position (±50 micron) like for QFN leadframes.

BESI / MECO

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