EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200 

The industry proven CLUSTERLINE® 300 is a flexible cluster platform allowing easy tool configuration with single process modules or unique batch sputter module technology.

System Highlights

Choose CLUSTERLINE® 300 for Wafer Level Packaging, Backside Metallization / Thin Wafer Processing and selected applications in Optoelectronics.

-Integration of single process modules for PVD, highly ionized PVD, and Soft Etch
-Thin wafer handling capability down to 300 μm and wafer bow up to 4mm; 
-200/300mm bridge or split tool compliant
-New Degas and Artic dome etch technology for handling strongly outgassing organic substrates in WLP applications
-Load Port Modules with 300mm FOUP load ports or open cassettes for 200mm
-Wafer aligner for rotational pre-alignment (0.3°) and centering of wafers (0.05mm)


EVATEC / UNAXIS / OERLIKON / BALZERS

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