MarTek, Inc. is a manufacturer of advanced wafer probers and testing solutions for the world-wide semiconductor industry. MarTek was formed more than 20 years ago to support Electroglas products. With MarTek’s acquisition of the Electroglas Intellectual Property, MarTek now combines more decades of Electroglas expertise than any competitor, to better support integrated device manufacturers (IDMs), wafer foundries, and outsourced assembly and test (OSAT) suppliers to improve their overall effectiveness at semiconductor wafer testing. Electroglas primary product line is automated wafer probing equipment and related network software to manage information from that equipment. In conjunction with automated test systems from other suppliers, Electroglas semiconductor manufacturing customers use wafer probers and network software to quality test semiconductor wafers.

EG5/300: Introduced in 1999, the EG5/300 is a new generation of wafer prober from Electroglas. It is targeted at the emerging 300mm wafer probing market. The EG5/300 utilizes a completely new system architecture that allows for faster and more accurate probing over the larger wafer sizes. Closed loop motion control and linear motors ensure precise wafer positioning over a wide range of temperatures and operating conditions. A modular design allows for configuration flexibility to meet the diverse needs of the emerging 300mm market. The EG5/300 uses a new version of the Company's EGCommander system software, which runs under the Windows-NT operating system.


MARTEK / ELECTROGLAS (EG)

EG5/300

The Electroglas Model 131B is a fast and easy-to-use motorized/manual wafer prober. It is deal for laboratory and limited production testing of transistors, diodes and microcircuits. Since its motorized probe-wafer motion is actuated by a foot pedal, operator's hands are always free for wafer positioning, alignment and manual inking.

131B

EG2001CX

The QuickSilver series of products feature sophisticated technologies, such as Time Delay Integration (TDI) for high speed acquisition of complex images. There are four products distinguished by their software packages. The QuickSilver 100 is primarily for microstructure inspection applications.

QUICKSILVER 100

Sidewinder:  Introduced in 2003, Sidewinder provides final test handling of packaged semiconductor and discrete components in panel or lead frame format. Termed “strip testing”, Sidewinder’s technology enables the handling of fine geometry packages such as chip scale packages (CSP) that are difficult to test in singulated format, and higher parallel test capability for small outline package (SOP), quad flat no-lead (QFN), and other well established high volume packages. The first strip test handler to be based on advanced 300mm prober technology, Sidewinder combines Electroglas’ proven prober stage with a sophisticated machine vision-based alignment system that offers improved accuracy and system throughput. Sidewinder’s market is comprised of companies who need technology that enables them to test advanced devices in new packages, as well as companies seeking increased efficiency in testing traditional packages in panel or lead format.



SIDEWINDER

4090FX PATHFINDER

3001

2080

EG5/300e: The EG5/300e, introduced in December 2000, is targeted at the parametric test ("e-test") segment of the 300mm market. Based on the EG5/300, the EG5/300e incorporates patented technology licensed from partner, Cascade Microtech Inc. This technology allows extremely precise, low-level electrical measurements to be made at the wafer level. This type of electrical measurement performance is becoming increasingly critical for advanced sub-micron semiconductor processes.

EG5/300e

4090µ+

The QuickSilver series of products feature sophisticated technologies, such as Time Delay Integration (TDI) for high speed acquisition of complex images. There are four products distinguished by their software packages. The QuickSilver 300 and 330 are targeted at bump inspection applications.


QUICKSILVER 300

The EG6000t: Introduced in July of 2008, the new EG6000t is the second generation of our flagship 300mm wafer prober product line that fuses automation and reliability requirements of high volume manufacturing environments with the highest caliber of prober technology, producing the world’s most accurate 300mm production wafer probers.  The EG6000t combines improved probe card finding optics, increased wafer pre-align, cassette loading and mapping speeds together with increased loader pre-alignment accuracy to produce smooth, fast and precise operation.  The EG6000t also provides a new generation of overall z accuracy with proprietary grid-based wafer surface mapping and advanced probe-to-pad alignment optics and algorithms.  Along with increased z accuracy, when implemented with the MicroTouch feature that allows for precise control of z-stage velocities, it enables the EG6000t to reduce overall damage to aluminum capped copper pads, low k dielectrics, circuitry under pads, in addition to extending the life of probe cards used on the tool during production.  These advanced features of the EG6000t are critical elements when probing advanced device technologies.

EG6000t

Parametric Probers:  The EG6000e, introduced in December 2005 is targeted at the parametric test (“e-test”) segment of the wafer probe market. This system incorporates patented technology licensed from, Cascade Microtech, Inc. This technology allows extremely precise, low-level electrical measurements to be made at the wafer level. This type of electrical measurement performance is becoming increasingly critical for advanced sub-micron semiconductor processes.

EG6000e

EG5/300e and EG4/200e: The EG5/300e, introduced in December 2000, and the EG4/200e, introduced in July 2001, are targeted at the parametric test (“e-test”) segment of the wafer probe market. The EG5/300e, based on the EG5/300, is targeted at the emerging 300mm market. The EG4/200e, based on the EG4/200 platform is for the 200mm market. Both systems incorporate patented technology licensed from partner, Cascade Microtech Inc. This technology allows extremely precise, low-level electrical measurements to be made at the wafer level. This type of electrical measurement performance is becoming increasingly critical for advanced sub-micron semiconductor processes.

EG4/200e

The QuickSilver series of products feature sophisticated technologies, such as Time Delay Integration (TDI) for high speed acquisition of complex images. There are four products distinguished by their software packages. The QuickSilver 200
focuses on defect inspection.

QUICKSILVER 200

2080S

The 2000 Series consists of the 2001CX Base Prober, the 2001CX Automatic Prober and the 2010CX Automatic Prober. The flexibility and upgradability inherent in the modular design concept of the 2000 Series is intended to provide a cost effective solution for all production environments by extending the operating life of the product.

2010CX

5300

The QuickSilver series of products feature sophisticated technologies, such as Time Delay Integration (TDI) for high speed acquisition of complex images. There are four products distinguished by their software packages. The QuickSilver 300 and 330 are targeted at bump inspection applications.

QUICKSILVER 330

This product line is positioned to satisfy high volume semiconductor manufacturing applications. The Horizon 4000 Series provides many advanced automation capabilities including automatic probe-to-pad-alignment, in-process inspection and optical character recognition (OCR). Optional for Horizon Series probers is a temperature controlled chuck top, providing the ability to maintain precisely a customer-selected wafer temperature during testing. The Horizon 4090, and Horizon 4090u micro utilize the Company's EGCommander system software. The 4090u prober also offers an integrated mini-environment and clean air system to provide a class 1 probing environment.

HORIZON 4090µ

Horizon 4000 Series:  The 4090µ+ (4090 Micro Plus) was introduced in Q4 2004 and is the new extended performance wafer prober system for 200mm wafers. The 4090µ+ addresses the demands of testing fine pitch devices, semiconductors with copper interconnects and low-k dielectric processes, and other advanced applications. Employing MicroTouch™, a feature that decreases the impact force as the probe pins contact the bond pads, the 4090µ+ reduces touchdown damage that can occur when testing fragile copper and low k devices or when pads are located over active circuit geometry. The 4090µ+ increases test cell availability and throughput while simultaneously reducing test cost by making improvements in how probe-to-pad alignment is maintained in varying temperature environments. In addition, the 4090µ+ has simplified and fully automated operations for high volume manufacturing applications, such as those that exist in integrated device manufacturer (IDM) and contract test facilities.  Customers who want to use the latest high productivity 200mm probing solution from Electroglas can also cost-effectively upgrade existing Electroglas 4080, 4090 and 4090µ prober systems with 4090µ+ technology.

HORIZON 4090µ+

Introducing the EG2001x Automatic Wafer Prober: Designed for semiconductor wafers, it handles 150mm wafers of silicon, glass, or polyimide-coated glass, with the option to use stainless steel, PEN on alumina, and other substrates. Automate loading, alignment, and probing of multiple wafer locations effortlessly. Additionally, it offers manual operation for added flexibility.

EG2001X

The Horizon 4000 Series of automatic wafer probers consists of four models, Horizon 4060X, Horizon 4080X, Horizon 4085X and Horizon 4090, the latter being introduced in 1996. This product line is positioned to satisfy high volume semiconductor manufacturing applications. The Horizon 4000 Series provides many advanced automation capabilities including automatic probe-to-pad optimization and alignment, in-process inspection and optical character recognition. Optional for Horizon Series probers is a temperature controlled chuck top, providing the ability to maintain precisely a customer-selected wafer temperature during testing. The Horizon 4060X, Horizon 4080X and Horizon 4090 utilize the Company's EGCommander system software.

HORIZON 4090

Introducing the Electroglas 2001x Wafer Prober: Precision meets efficiency. Probe wafers 75mm to 150mm with ease. Optional networking for large data sets. Accurate step and repeat motor (0.2mil or 5μm). Max x-y speed of 250 mm/s. Precise rotation via CCD image processing (±10º). Optional 25-wafer loader. Easy integration: 75PSI air, 25in/hg vacuum, standard 120V power. Unmatched semiconductor testing performance.

EG2001

HORIZON 4080X

The EG6000: Developed in 2004 and introduced in January 2005, the new EG6000 300mm probing system from Electroglas fuses advanced automation with the highest caliber of prober technology. Representing a major advancement in prober design and automation, the system is the only 300mm prober that employs precision direct-drive technology to enable it to achieve the highest positioning accuracy currently available. Simultaneously, the prober can deliver the fastest throughput obtainable as measured from lot-start to lot-end. Designed for advanced applications such as copper and low k dielectrics, the system employs a proprietary stage and control technology to enable highly accurate positioning of the test devices while moving devices into contact with the probes for test. MicroTouch adds the ability to control the impact forces while probing on delicate devices. The EG6000 features the new Advanced Vision System for better accuracy, robustness and speed in aligning devices to the probe card for test. It also features a sophisticated system for automatically measuring and compensating for thermal changes in the system components while testing at hot or cold temperatures. The EG6000 is based on the same core architecture as the prior 5|300 prober which served the relatively small market for parametric test and process development applications. The EG6000 features a broader range of application capabilities as well as many refinements and improvements in accuracy, throughput, automation, and reliability. This allows the EG6000 to address customer’s needs for high volume production wafer test that forms the large majority of the 300mm prober market.



EG6000

2001CX

3001X

The Electroglas Horizon 4085X Automatic Wafer Prober System is a precision manufacturing machine which moves wafer through the test process quickly, accurately, and safely. It is designed to probe high - pin - count devices, performing with high accuracy in an enclosed clean environment. Probing accuracy is certified to +/- 0.25 mil, required for probing small densely packed bond pads.

HORIZON 4085X

HINGED MANIPULATOR

Pathfinder: Introduced in 2002, the Pathfinder system is designed to meet the unique test handling requirements of the Known Good Die (KGD) and Chip-scale package markets. The Pathfinder system features a unique material handling system that can handle and position wafers and packages after they have been sawn (“diced”). Special alignment techniques are used to compensate for the variability inherent in these sawn wafers and packages.

PATHFINDER 

2001CXE

1034

HORIZON 4060X

Horizon 4000 Series: The 4090u (micro) and the 4090f are the Company's primary offerings in the Horizon 4000 Series of wafer probers. This product line is positioned to satisfy high-volume semiconductor manufacturing applications. The Horizon 4000 Series provides many advanced automation capabilities, including automatic probe-to-pad-alignment, in-process inspection and optical character recognition (OCR), and a temperature-controlled chuck top, providing the ability to maintain precisely a customer-selected wafer temperature during testing.

The 4090f prober has a unique wafer handing system that allows wafers to be probed which could not normally be handled on an automated prober. The Horizon Series utilizes the Company's EGCommander system software, which allows significant application and customer driven customization of the wafer prober and is compatible with the standard MS-DOS operating system. The user interface features color graphics, touch screen programming, probing recipes, control maps, and real-time maps. The Horizon 4000 Series probers feature a distributed multiple processor architecture to maximize productivity and expandability.

HORIZON 4090f

4090uT

The EG4/200: Introduced in 1999, the EG4/200 is targeted at high-end probing applications for 200mm wafers. The EG4/200 utilizes a unique "probe-centered z-drive" to provide very low deflections even under extremely high probe forces. This is important when testing multi-site or high pin count devices. The EG4/200 retains many of the features of the Horizon 4090 series probers such as linear motor and air-bearing positioning system. The EG4/200 uses a new version of the Company's EGCommander system software, which runs under the Windows-NT operating system.

EG4/200

2080X

 In 1973 Electroglas introduced the revolutionary 1034X wafer prober, which reduced operator involvement with a high-speed, friction less, automatic positioning system. It was based on a proprietary linear motor technology, the “Sawyer motor” which was originally developed in the ’70s to drive large scale plotters.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

MARTEK / ELECTROGLAS (EG)

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EG5/300

131B

EG2001CX

QUICKSILVER 100

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