THE EBARA FREX 300S IS EBARA FREX 300S SYSTEM. The EBARA FREX 300S can be used with 12” wafer size.

EBARA

FREX-300S

AA40WV1-H

A10S

ESR80WN

AA10

AA40W

A30W

This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

FREX-300

ESR100WN

A150W M

AA70WV1-H

A07V

AAE40WN

40 X 20

EAC300BI-T

AA100W

A70W

AA100V1 H

AA200W

GDC 250 SA

AA30

ET300WS	

AA200WN

EV-M102N	

50 X 20

AA70W

AA40WN

AA10N	

EST 500 WN

FREX-300 S2

40X20ERD5M-NJ

GDS500SA	

AA10V1

AA70WN

EPO 222T

40X20ERD5M

EST 200 WN

80 X 25

AA10Nv1	

50X20UERR6M

ESR 80W	

A25S

AAS20N

EPO-222D

EPO 222

ESR200WN

EPO 223

GDC250A

A300W	

306W	

IQDP 40

EV-S20

EMT2400MBWC	

GDS250SA

ESA70W-D

UFP 200 / 300M

A70WN	

UFP-100/150A

CS-22

AA20N

FREX-300X

A30W N

EPO 222A

UERR6M 50X20 

A40W

ESA25-D

80x25UERR6M	

EPO-2226D

40×20 ERD5M-N

EV-A06-3

FREX M2

AA70WNV1-H

ESR100-CN

UFP 300A

EPO 213

ESR 201W

AA30W

UFP 200/300A

EST 100 WN

A150W

EST 300 WN

AA10NV1-H

150 X 40

EV-A03-1

A150W-T

JSM-6320

EPO 113

ESR20N

AAS200WN

AA40WNV1-E

FREX 200M2

AAS100WN

305W

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

FREX-200

EBARA

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