EBARA

A30W

AA40WV1-H

EPOS-010

THE EBARA FREX 300S IS EBARA FREX 300S SYSTEM. The EBARA FREX 300S can be used with 12” wafer size.

F-REX300S

AA40W

ESR80WN

AA10

A150W M

A10S

AA70WV1-H

A07V

AAE40WN

AA70W

40 X 20

AA200W

This 300mm CPM system uses EBARA’s Dry-In/ Dry-Out processing and two-head/ two platen design for maximum operation flexibility. Features include 3-step cleaning, 4 FOUP loading ports, and buff stations.

F-REX300

EAC300BI-T

AA100W

AA200WN

AA100V1 H

ESR200WN

GDC 250 SA

EPO 222

A70W

150X40 UERP6M

50 X 20

AA30

A25S

AA40WN

UFP-100/150A

EPO 223

AA20N

AAS100WN

A70WN	

GDS500SA	

AA70WN

A150W-T

50X20UERR6M

40X20ERD5M-NJ

40X20ERD5M

AA10N	

ESR20N

EPO 222T

The F-REX300S2 and F-REX300X3SC offers a four head, four platen with three step clean design allowing for customized process recipes with the demonstrated capability to reliably meet 7nm technology requirements. 

F-REX300SII

AA20

ET600H-US

GDS250SA

Vacuum Dry Pump AA20-H, 200V, 50/60 Hz, Horizontal Outlet

AA20-H

Vacuum Dry Pump AA20N-H, 200V, 50/60 Hz, Corrosian Resist, Horizontal Outlet, with Exhaust Pressure Sensor

AA20N-H

ET1600WS

305W

AA70W-H

AA70WN-H

EMT2400MBWC	

80 X 25

ESA25-D

Dry Pump
Pumping Speed (60 Hz): 30,000 l/min


ESA300W

UERR6M 50X20 

EST 200 WN

EST 500 WN

A30W N

A300W	

CS-22

GDC250A

JSM-6320

AA10NV1-H

80x25UERR6M	

ESR100-CN

EST 300 WN

EBARA FREX 200 is a CMP system which is used for wafer grinding, lapping, and polishing. The FREX 200 is compatible with 200mm wafer size.

F-REX200

IQDP 40

UFP 200/300A

AA40WNV1-E

EV-A06-3

UFP 300A

A40W

AA10Nv1	

ET300WS	

EPO-222D

EV-M102N	

ESR100WN

AAS200WN

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0Pa

EV-S20P

306W	

EV-A03-1

EPO-2226D

EBARA's CMP system Model F-REX is Chemical Mechanical Polishing system that enables nanometer level planarity (10~20nm on 300mm wafer) in semiconductor manufacturing process. Ebara's CMP system, Model F-REX200M2 and F-REX300X has achieved both an advanced
process performance and high productivity. This is made possible with "1-head per 1-table" unique architecture processing an individual wafer delicately while the "4 table platform" enables high throughput.

F-REX200M2

EST 100 WN

EPO 213

AAS20N

AA10V1

EPO 222A

AA30W

Pumping speed (N2) l/min. 7000
Pumping speed (N2) m3/h 420
Ultimate pressure mbar 2x10-3
Ultimate pressure Pa 0.2
Water Consumption l/min 3.5-8
Nitrogen Consumption SLM 11-13
Nitrogen Consumption Pa m3/sec 19-22
Voltages ranges V 200-220/380-415
Motor power, installed kW 7.5
Weight, approx. kg 280
Sizes (LxWxH) mm 830x400x800
Inlet flange size DN 50 KF
Outlet flange size DN 40 KF

AAS70WN

Pumping Speed: 1670 L/min
Ultimate Pressure: 5.0 Pa

EV-S20N

The Model EV-M302N dry vacuum pumps are designed for high-load applications where large volumes of reaction byproducts are generated. Its outstanding power consumption performance and enhanced corrosion resistance, as a standard, support a broad range of industry applications.           

Options:
-Various Booster & Exhaust Thermal Configurations (Process Dependent)
-ESD Resistance
-Idle Mode (Green Energy Mode)
-Hardware: Seismic Brackets
-Pump Systems – Integrated Rack Solutions
-Pump Installation Lifts
-Reusable Shipping Crates

EV-M302N

150 X 40

150X40UERP6M-J

MS-96770-1T/011126401

AA100W-H

EBARA

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