Aviza Technology, Inc. designs, manufactures, sells and supports advanced semiconductor capital equipment and process technologies for the global semiconductor industry and related markets. Aviza systems are used in a variety of segments of the semiconductor market, such as advanced silicon for memory devices, advanced 3-D packaging and power integrated circuits for communications. 

The THERMCO AVIZA VTR 7000 is a versatile vertical furnace designed for wafer processing up to 200mm and below. It offers a low cost of ownership, high process flexibility, and efficient throughput, making it suitable for meeting the process requirements of multiple generations of semiconductor devices

AVIZA / SVG / THERMCO

VTR 7000

5204

The RVP-300 is the latest addition to the vertical furnace product line. RVP-300 is designed for processing of 300mm (12 inch) wafers addressing requirements for 0.18 micron technology and beyond. The design of RVP-300 focuses on maximizing productivity and throughput. This is done by utilizing features such as fast temperature ramp up and ramp down capability, Model Based Temperature Control (MBTC) for optimized temperature control across the wafer, and a dual boat configuration.

RVP-300

This four-chamber furnace is built to process semiconductor, nano, PV, LED, and MEMS substrates up to 150 mm in diameter. Constructed from steel, Thermco’s Model 5200 Diffusion Furnace is designed to withstand operating temperatures of 200-1250°C with a cool down rate of at least 3°C per minute. The furnace is controlled by a Thermco TMX controller and its system includes one MUX computer and one control computer per tube. Each chamber accommodates process tubes up to 10 inches (251 mm) in diameter. Compatible with Model 5000LS, D1, D2, and 5000SC.

5200

The SVG VTR 7107 TOX is a Vertical Diffusion Furnace designed for processing wafers with sizes ranging from 6 inches to 8 inches (100mm-200mm). This furnace is utilized in the semiconductor industry for thermal processing and diffusion of materials on the wafers. It offers a vertical configuration, ensuring efficient and uniform heating across the wafer surface, resulting in precise and controlled diffusion processes. 

VTR 7107 TOX

AVP 8000 LP TEOS

The AVIZA AVP 8200 is a vertical furnace with precise thermal control ranging from 100 to over 1200°C. It features advanced injector technology, ensuring optimal gas distribution for the epitaxial growth process. Additionally, the furnace is equipped with a low O2 load lock, which helps maintain a controlled environment for wafers and ensures excellent repeatability in the process.

AVP 8200

The SVG VTR 6000 is a diffusion furnace designed for rapid thermal processing (RTP).

VTR 6000

EVOLVE

The THERMCO AVIZA VTR 7000+ is an upgraded vertical furnace, designed as an improvement to the SVG Thermco VTR 6000/7000 series. It is capable of being configured for processing wafers in the 150mm to 200mm nodes, making it suitable for a range of semiconductor manufacturing applications. Notable features of the THERMCO AVIZA VTR 7000+ include a modern TMX tube controller, which replaces the outdated PCE system found in the VTR 6000/7000 series, a robotic controller for enhanced automation, and SPC functionality for monitoring equipment performance. 

VTR 7000plus

For high volume manufacturing for up to 300-mm wafers at 90 nm with extendibility to 65 nm.
RVP-300plus is designed for processing 300mm wafers addressing requirements for 0.13-micron and smaller geometries. The design of the RVP-300plus focuses on maximizing productivity and throughput. Among its features, the RVP-300plus is capable of rapidly ramping the temperature up and down, which results in chemical deposition and temperature control across the wafer. The RVP-300plus also utilizes a dual-cassette configuration resulting in increased throughput.


RVP-300plus

RVP-500

The RVP-200 features a design that enables it to ramp up and ramp down temperatures between two to ten times faster than the AVP platform and offers faster throughput and tighter junction depth control. By utilizing the AVP platform features such as 16-cassette wafer handling and advanced temperature control, the RVP-200 is designed to offer the same advanced reliability as our AVP systems.

RVP-200

For 150-mm and 200-mm wafers from 350 nm to 90 nm.
The AVP-200 single-tube system includes advanced process control, data acquisition software, advanced automation, a proprietary process chamber design and an option for atmospheric control within the wafer handling area. Key features of the AVP system include storage capacity for sixteen 25-wafer cassettes, or a total of 400 wafers, and advanced temperature control for accurate wafer temperature regulation. We designed the AVP system to offer customers a low cost of ownership through high productivity and a small footprint.

AVP-200

The AVP-8000 is a vertical batch furnace with a flexible platform for diffusion, oxidation, and LPCVD processes. It is a previous version of the AVP Ace and can handle 150-200mm wafers. Some features of the AVP-8000 include a small footprint that enables side by side installation, low cost of ownership, single or dual boat configuration, and the ability to handle up to 200 wafer batches. It also has flexible substrate handling for 150mm and/or 200mm wafers, including perforated and thin/bowed wafers. Some of its applications include wet/dry thermal oxide, radical oxidation, silicon nitride (stoichiometric and low stress), TEOS, SiH4 and DCS-based SiO2, doped (P, As, B) and un-doped polysilicon, atomic layer deposition, and anneal and cure from 100 to >1200°C.

AVP 8000

AVP 9000

RVP-550 is a flexible batch heating system with Across-Flow technology and is designed to process loads up to 100 wafers. Our Across-Flow technology generates a virtual single-wafer environment intended to result in improved process performance. We believe that the RVP-550 is well suited for advanced technology applications in a high product mix manufacturing process typically found at an advanced foundry customer.

AVIZA / SVG / THERMCO

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VTR 7000

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