AWP wet benches are configurable for nearly all clean, etch, strip & solvent applications:

- Available for both 200mm and 300mm wafer processing
- Fully integrated superior Marangoni® drying technology as standard
- High throughput due to dual dryer capability and advanced scheduler
- Lowest COO based on extended bath life with concentration control and spiking
- Field proven robust performance and reliability with more than 300 tools installed
- Typical field data (US, Europe, Asia): 96% uptime
- Reliable software with functional host interface for high flexibility

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TwinStep-B H3P04 

Efficient cleaning tool for all common types of carrier, boxes, SMIF-Pods, and FOUPs.

CLEANSTEP CBII

The wide process window of the AeroSonic dryer offers the possibility of tailored recipes for various substrate materials such as Si, SiO2, quartz and GaAs, regardless of hydrophilic or hydrophobic surfaces. There is no limitation in wafer size - it is applicable to all wafer diameters used today. It’s even possible to dry different wafers or substrates sizes simultaneously within one process bath.

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TwinStep-B H3P04

CLEANSTEP CBII

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