Akrion focuses on multiple wet process solutions for semiconductor applications where high yield and low cost of ownership is a challenge. Each process step in device manufacturing presents an opportunity for contamination, which can result in defect formation and device failure, therefore critical cleaning is an integral part of our equipment’s capabilities.

Designed for the most cutting-edge devices, the fully-automated, carrierless Pinnacle batch immersion wet station utilizes the most advanced wafer handling and process control subsystems to ensure the optimum process results for manufacturers of digital integrated circuits. Substrate Size: 300mm

AKRION

PINNACLE 300

Bpure series of tube/boat cleaning tools provides customized cleaning (immersion or spray) of critical diffusion furnace components. Applicable Parts: 300 mm Tubes and Boats Applicable Materials: Quartz, SiC Technology Markets: Analog IC, Digital IC, Power IC, MEMS, Advanced Packaging.

BPURE TC3000A

Bpure series of tube/boat cleaning tools provides customized cleaning (immersion or spray) of critical diffusion furnace components. Applicable Parts: 200 mm Tubes and Boats Applicable Materials: Quartz, SiC Technology Markets: Analog IC, Digital IC, Power IC, MEMS, Advanced Packaging.

BPURE TC2000A

V3 Compact Batch Immersion System offering either dry-to-dry or dry-to-wet processing with low exhaust requirements, few facility connections and easy maintenance access, while maintaining as much as a 20 percent footprint reduction over comparable tool sets. The V3 robot is designed to accommodate 150 mm or 200 mm wafers in standard cassettes for IC devices; alternate cassettes allow other materials to be processed using the standard robot arm. Suitable for R&D labs and applications.

UP V2 MP.2000

The E200 is a modular, linear wet bench offering both traditional and innovative surface preparation solutions.

E200

Designed for the most cutting-edge devices, the fully-automated, carrierless Pinnacle batch immersion wet station utilizes the most advanced wafer handling and process control subsystems to ensure the optimum process results for manufacturers of digital integrated circuits. Substrate Size: 200mm

PINNACLE 200

GAMA1-LR

The Bcube series of wet cleaning and etching equipment provides excellent process results for manufacturing MEMS, LEDs, and power semiconductors. Applicable processes include pre-cleaning, PR strip, RCA clean, pre-epi clean de-glue cleaning, pre- / post- diffusion cleaning, and various etching process steps. Systems are available for a variety of substrate materials including Si, SiC, Germanium, Aluminum oxide and III-IV compound semiconductors.

BCUBE WSC

The Saqua series of 300 mm single-wafer cleaning system utilizes single wafer, precisely controlled spin-spray wet cleaning technology to remove a variety of post metal etch particles and byproducts. The Saqua can be configured with up to eight independent process chambers designed for cleaning feature sizes as small as 14 nm. 

SAQUA

V3 plus

SPM, SPOM, SOM & PRM applications on SCP 9400 systems with "older style" manifolds with butt-welded valves.

SCP 9400

The AKRION GAMA is a series of automated wet stations that are flexible and modular. They are suitable for a wide variety of cleaning, etching and stripping applications for bare and reclaimed silicon wafers, IC devices, MEMS and photomasks. The GAMA series is designed to provide high throughput and precision cleaning for semiconductor manufacturing processes.

GAMA

4 chamber versions. The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics.

GOLDFINGER VELOCITY4

UP-V2-HL 2000

UP-V2 SA 3200

MP 2000

The Velocity single wafer product line is focused on improving defectivity. This includes removal of particle and residue contamination from the wafer frontside, backside and edge. Defects are removed without physical damage to sensitive structures and without film etching. This is accomplished using advanced physical clean technologies – Goldfinger Megasonics, Jetstream Nano and Backside Megasonics. Watermark-free performance is available with Sahara dry. The Velocity 6 chamber versions, each with stacked chambers to minimize footprint. The technology and platform are used for particle removal (post deposition, sensitive structures, backside and post post CMP) and post etch/ash (FEOL and BEOL) applications.

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

AKRION

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PINNACLE 300

BPURE TC3000A

BPURE TC2000A

V3

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