Description
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxideConfiguration
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEM Model Description
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.Documents
No documents
BENEQ
TFS 200
CATEGORY
ALD
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
150901
Wafer Sizes:
Unknown
Vintage:
2012
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Primary Uses - Aluminum oxide Tin oxide Titanium oxide Zinc oxideConfiguration
-single-chamber -no load lock -Thermal chamber (no plasma), with an ozone generator. -Includes pump and transformer -PC was just upgraded -New MFC was installed recently Sources: Hot: TDMA-Sn H20 DEZ TiCl4 TMA O3OEM Model Description
Beneq TFS 200 is the most flexible ALD research platform ever designed for academic research and corporate R&D. Beneq TFS 200 has specifically been designed to minimize any cross contamination that could happen in a multi-user research environment. The large number of available options and upgrades means that your Beneq TFS 200 will grow with you to meet even the most demanding research requirements. Beneq TFS 200 represents technical solutions that enable deposition of superior quality coatings on wafers, planar objects, porous bulk materials and complex 3D objects with very high aspect ratio (HAR) features. Direct and remote plasma-enhanced deposition (PEALD) is available in Beneq TFS 200 as a standard option. The plasma is capacitively-coupled (CCP), which is the industry standard today. The CCP plasma option offers both direct and remote plasma-enhanced ALD (PEALD) for substrates up to 200mm, face-up or face-down.Documents
No documents