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ASM EAGLE XP5
    Description
    2010 ASM Eagle XP5 PEALD
    Configuration
    Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) See the configuration file below to download along with other documents. Full set of schematics available on request. Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Notes The ASM Eagle is like new. It was never used in Production and only used to test wafers. One chamber had a throttle valve issue and RF Gen issue. The RF Gen was replaced but they did not replace the throttle valve so only one chamber was used to test the wafers. The liquid gas panel was not used. There are 2 spare MFCs included. Are you in need of a high-precision, reliable tool for creating thin film coatings on your semiconductor substrates? Look no further than the 2010 ASM Eagle XP5 PEALD system! This advanced machine utilizes plasma-enhanced atomic layer deposition (PEALD) technology to create ultra-thin, uniform coatings on a variety of substrate materials. It is capable of producing coatings with exceptional uniformity and reproducibility, making it ideal for a wide range of applications in the semiconductor industry. The ASM Eagle XP5 is a versatile tool that can be used to deposit a wide range of materials, including metals, oxides, and other compounds. It is also capable of operating at a range of process pressures and temperatures, making it suitable for use in a variety of manufacturing environments. In addition to its impressive coating capabilities, the ASM Eagle XP5 is also built with durability and ease of maintenance in mind. It has a robust design and is backed by ASM's reputation for producing high-quality, reliable equipment. Don't miss out on this opportunity to add a powerful, flexible thin film coating system to your manufacturing arsenal. Purchase the 2010 ASM Eagle XP5 PEALD today and take your semiconductor production to the next level!
    OEM Model Description
    Plasma enhanced atomic layer deposition
    Documents

    No documents

    PREFERRED
     
    SELLER
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    Verified

    CATEGORY
    ALD

    Last Verified: 24 days ago

    Buyer pays 12% premium of final sale price
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    120626


    Wafer Sizes:

    Unknown


    Vintage:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    Buyer pays 12% premium of final sale price
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    120626


    Wafer Sizes:

    Unknown


    Vintage:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    2010 ASM Eagle XP5 PEALD
    Configuration
    Tool Status: Deinstalled and crated and in storage. (March 2023) Wafer Size 300 mm Process PE-ALD System Software Version Eagle I ASMJ software (Windows embedded XP / OS) See the configuration file below to download along with other documents. Full set of schematics available on request. Process PE-ALD Oxide, HT-SiO/HT-SiN Hardware Configuration (fab): Main System ASM PE-ALD System Mainframe 1 Handler System FI: Kawasaki / Vac: JEL 1 Factory Interface FOUP 2 Options System Others Process Chamber (RC3 / RC4) 2 Hardware Configuration (subfab/ auxiliary units): Power Rack 1 Notes The ASM Eagle is like new. It was never used in Production and only used to test wafers. One chamber had a throttle valve issue and RF Gen issue. The RF Gen was replaced but they did not replace the throttle valve so only one chamber was used to test the wafers. The liquid gas panel was not used. There are 2 spare MFCs included. Are you in need of a high-precision, reliable tool for creating thin film coatings on your semiconductor substrates? Look no further than the 2010 ASM Eagle XP5 PEALD system! This advanced machine utilizes plasma-enhanced atomic layer deposition (PEALD) technology to create ultra-thin, uniform coatings on a variety of substrate materials. It is capable of producing coatings with exceptional uniformity and reproducibility, making it ideal for a wide range of applications in the semiconductor industry. The ASM Eagle XP5 is a versatile tool that can be used to deposit a wide range of materials, including metals, oxides, and other compounds. It is also capable of operating at a range of process pressures and temperatures, making it suitable for use in a variety of manufacturing environments. In addition to its impressive coating capabilities, the ASM Eagle XP5 is also built with durability and ease of maintenance in mind. It has a robust design and is backed by ASM's reputation for producing high-quality, reliable equipment. Don't miss out on this opportunity to add a powerful, flexible thin film coating system to your manufacturing arsenal. Purchase the 2010 ASM Eagle XP5 PEALD today and take your semiconductor production to the next level!
    OEM Model Description
    Plasma enhanced atomic layer deposition
    Documents

    No documents

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