NSR-S308F (resolution ≦ 65 nm). The NSR-308F has a newly developed platform that enables dramatic improvements in alignment accuracy and throughput. Alignment accuracy has been reduced to 8 nm or less, a 44% improvement over Nikon’s previous generation ArF scanner, while throughput was increased to 140 wafers or more per hour for 300 mm wafers, an improvement of approximately 25%. With this significant increase in productivity, the system delivers next-generation process capabilities at a lower overall cost of ownership.

Semiconductors control a host of functions in electronic equipment. Nikon offers a stellar lineup of cutting-edge lithography systems that support precision circuit design down to the nanometer level.

NIKON

NSR-S308F

ASML provides chipmakers with everything they need – hardware, software and services – to mass produce patterns on silicon through lithography.

ASML

TWINSCAN XT:1250D

The FPA-5000ES3 is a KrF scanner with a 0.73 NA, designed for 130nm production. It is built on the Canon FPA-5000 scanning platform and incorporates experience from previous models. The ES3 has significant refinements, particularly in lens performance, and employs unique lens elements using Canon’s “wavefront engineering” method. Lens testing results show values much smaller than the manufacturing target, in some cases by as much as 30-40%.

Canon Inc. is the world’s largest camera manufacturer with a history spanning over 80 years, during which time they have made some of the most important innovations within both photographic and video technology.

193 nm Step and Scan

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Manufacturers of 193 nm Step and Scan

Top Products for 193 nm Step and Scan

NSR-S308F

TWINSCAN XT:1250D

FPA-5000ES3

TWINSCAN AT:1100B