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ESI 9830
    Description
    Working condition
    Configuration
    1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked (attach photo) 9. laser head working hours: around 60,000.
    OEM Model Description
    The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
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    ESI

    9830

    verified-listing-icon

    Verified

    CATEGORY

    Laser
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    36959

    Wafer Sizes:

    Unknown

    Vintage:

    2006

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    ESI

    9830

    verified-listing-icon

    Verified

    CATEGORY

    Laser
    Last Verified: Over 60 days ago
    listing-photo-32bf2928fdc04528b8de65530d0e3f23-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/32bf2928fdc04528b8de65530d0e3f23/a1eff0c032004a9588bb26d873779f32_71612cd9ab8444a2bec110ab5a524e8a_mw.jpeg
    listing-photo-32bf2928fdc04528b8de65530d0e3f23-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/32bf2928fdc04528b8de65530d0e3f23/86a8f0869e514bcfa5b25cb6ac86fc39_54e9b10e62bf443790a6cace30f84139_mw.jpeg
    listing-photo-32bf2928fdc04528b8de65530d0e3f23-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/32bf2928fdc04528b8de65530d0e3f23/eed39db27dcd4be98d1e84e5a502d53e_8308275de1794b70ac39e2527f962cec_mw.jpeg
    listing-photo-32bf2928fdc04528b8de65530d0e3f23-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1647/32bf2928fdc04528b8de65530d0e3f23/cc494a0699b34254ad01ec45f0145b65_88d3b9a3b1d44ddca74976bb9bb90255_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    36959

    Wafer Sizes:

    Unknown

    Vintage:

    2006

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Working condition
    Configuration
    1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked (attach photo) 9. laser head working hours: around 60,000.
    OEM Model Description
    The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.
    Documents

    No documents

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