Description
Laser Repair Working conditionConfiguration
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEM Model Description
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.Documents
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ESI
9830
Verified
CATEGORY
Laser
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50348
Wafer Sizes:
Unknown
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ESI
9830
CATEGORY
Laser
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
50348
Wafer Sizes:
Unknown
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Laser Repair Working conditionConfiguration
1. IR wave length 1.34um 2. Repair rate 50~100 kHz (standard type is 30KHz) 3. Spot size 1.5~3.5um 4. Laser stability < 15% 5. 8" & 12" wafer load port 6. OCR (two side) Front and Back side 7. Support SECS/GEM capability 8. Laser head worked 9. Link inspection FunctionOEM Model Description
The ESI 9830 is an advanced laser fuse processing system built on the successful 98XX platform, specifically designed for demanding applications in DRAM, SRAM, and embedded memory for semiconductor devices. With its wide process window and small spot sizes, it is optimized for 300mm wafer processing. The system excels at processing tight pitch metal fuses on 90nm semiconductor devices, making it ideal for high-throughput production environments. Its automated 300mm production capability and enhanced beam-positioning technology ensure efficient and reliable processing for semiconductor manufacturing.Documents
No documents