Description
Deep Access Wedge Wire Bonder Deep Reach: Remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Programming: Thirty different device types may be entered into separate buffers. Each device wire may have up to 21 stitch bonds with individual ultrasonic power, time, force (high or low) and loop elevation control data. Program values, action prompts, and fault diagnostics are exhibited on the easy to read 4 line, 40 character LCD sequentially with machine operation.Configuration
Programmable dual force (high or low), pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat. MEMORY: Battery back -up RAM DATA ENTRY: Selector switch Z TOOL RANGE: 0.5625 inch Z ENCODER RESOLUTION: 0.002 inch BOND FORCE RANGE: Adjustable, 10 to 250 grams ESD PROTECTION: Protection against Electrostatic Discharge DISPLAY: 4 line, 40 character LCD CONVENTIONAL TOOL LENGTH: 0.750 inch (7400E) MICROMANIPULATOR: Dual counterbalanced, single lever, 8:1 ratio WIRE SPOOL MOUNT: 0.5 inch with ball bearing rollers 110V, 50/60Hz, 10AOEM Model Description
Wedge Wire BonderDocuments
No documents
WESTBOND
7476E-79
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 3 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151297
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Deep Access Wedge Wire Bonder Deep Reach: Remote bond targets on large packages with WEST·BOND’S new throatless chassis and micromanipulator designs. All machine components, circuitry and enclosures are arrayed above the horizontal bond plane, eliminating any restrictions to package size or shape. Programming: Thirty different device types may be entered into separate buffers. Each device wire may have up to 21 stitch bonds with individual ultrasonic power, time, force (high or low) and loop elevation control data. Program values, action prompts, and fault diagnostics are exhibited on the easy to read 4 line, 40 character LCD sequentially with machine operation.Configuration
Programmable dual force (high or low), pure vertical Z, pneumatic braking of all axes during bonding, and radiant tool heat. MEMORY: Battery back -up RAM DATA ENTRY: Selector switch Z TOOL RANGE: 0.5625 inch Z ENCODER RESOLUTION: 0.002 inch BOND FORCE RANGE: Adjustable, 10 to 250 grams ESD PROTECTION: Protection against Electrostatic Discharge DISPLAY: 4 line, 40 character LCD CONVENTIONAL TOOL LENGTH: 0.750 inch (7400E) MICROMANIPULATOR: Dual counterbalanced, single lever, 8:1 ratio WIRE SPOOL MOUNT: 0.5 inch with ball bearing rollers 110V, 50/60Hz, 10AOEM Model Description
Wedge Wire BonderDocuments
No documents