Description
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns) by the popular thermocompression technique. This machine is the standard in the industry for bonding extremely small geometries and particularly GASFET devices. Operator has finite control of the bonding tool down to the last instant of positioning over the bond targets.Configuration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents
WESTBOND
7416A
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125444
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Bonds fine wires in the range of .5 mil (12 microns) to 2 mil (50 microns) by the popular thermocompression technique. This machine is the standard in the industry for bonding extremely small geometries and particularly GASFET devices. Operator has finite control of the bonding tool down to the last instant of positioning over the bond targets.Configuration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents