
Description
(60 degree feed) Ultrasonically bonds fine wires in the range of .7 mil (18 microns) to 4 mil (100 microns), and larger with added features. Independent wire feed and work-sensing tool makes this machine ideal for all wire bonding applications. The single-lever X-Y-Z manipulator is a natural for quick response to any work elevation without the need to set search heights.Configuration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents
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7400A
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
125441
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
(60 degree feed) Ultrasonically bonds fine wires in the range of .7 mil (18 microns) to 4 mil (100 microns), and larger with added features. Independent wire feed and work-sensing tool makes this machine ideal for all wire bonding applications. The single-lever X-Y-Z manipulator is a natural for quick response to any work elevation without the need to set search heights.Configuration
No ConfigurationOEM Model Description
Wire BonderDocuments
No documents