Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
SHINKAWA UTC 1000 SUPER
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    Documents

    No documents

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon

    Verified

    CATEGORY
    Wire / Wedge / Ball Bonder

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98179


    Wafer Sizes:

    Unknown


    Vintage:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball Bonder
    Vintage: 0Condition: Used
    Last VerifiedOver 30 days ago

    SHINKAWA

    UTC 1000 SUPER

    verified-listing-icon
    Verified
    CATEGORY
    Wire / Wedge / Ball Bonder
    Last Verified: Over 60 days ago
    listing-photo-2878aa36e4c74b06bacdcb7a17da9985-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98179


    Wafer Sizes:

    Unknown


    Vintage:

    2005


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The UTC-1000 Super wire bonder is a high-speed wire bonder that is compatible with SiP including stacked CSP. It is designed for bonding CSP, BGA, Small Substrate, and Lead Frame Type ICs. The UTC-1000 Super wire bonder is equipped with Shinkawa RPS technology, which is the world’s first capillary tip position closed-loop control that solves fine-pitch bonding misalignment and supports 40μm pad-pitch bonding. The Shinkawa NRS technology reduces vibration that hinders fine-pitch bonding and ensures stable bondability. The UTC-1000 Super wire bonder has various loop modes that are ideal for bonding stacked dies as standard. It also has numerous automatic functions that reduce the burden on the operator
    Documents

    No documents

    Similar Listings
    View All
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball BonderVintage: 0Condition: UsedLast Verified:Over 30 days ago
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball BonderVintage: 2005Condition: UsedLast Verified:Over 60 days ago
    SHINKAWA UTC 1000 SUPER

    SHINKAWA

    UTC 1000 SUPER

    Wire / Wedge / Ball BonderVintage: 0Condition: UsedLast Verified:Over 60 days ago