Description

wire bonding machine Machine weight (KG):500KG

Configuration

WIRE BOND

OEM Model Description

The ps(Power Series) IConnPS ball bonder, which replaced the Maxum Ultra ball bonder and improves IC inter-connect performance with expanded technology that addresses advanced packaging requirements, copper wire bonding, and ultra fine pitch capability.

Documents

No documents

KULICKE & SOFFA (K&S)

IConn

Verified

Wire / Wedge / Ball Bonder

Last Verified: 13 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

141489

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Similar Listings