Description

No description

Configuration

No Configuration

OEM Model Description

The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.

Documents

No documents

KULICKE & SOFFA (K&S)

AT Premier

Verified

Wire / Wedge / Ball Bonder

Last Verified: 18 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

151827

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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