Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.Documents
No documents
KULICKE & SOFFA (K&S)
AT PREMIER
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
84310
Wafer Sizes:
Unknown
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
KULICKE & SOFFA (K&S)
AT PREMIER
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
84310
Wafer Sizes:
Unknown
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The AT Premier is targeted for gold-to-gold interconnect in the growing flip chip market. With industry leading speed and technology, the machine lowers the cost of ownership for stud bumping, enabling a wider range of applications than previously served.Documents
No documents