Description
No descriptionConfiguration
Work size: 50-300 mm Wire diameter: 15-50 µm Interface: SECS II / GEM Bump placement accuracy: ±3.5 µm 2D Barcode reading Wafer mapping Vertical wire looping process Cu Wire bonding Au Wire: 0.6 to 2.0 mil Cu Wire: 0.7 to 1.5 mil LCD Monitor, 17" Lamp indicator: Tower type Hard Disk Drive (HDD) USB Driver Manuals included Noise level: 80 dB Maximum power consumption: 1.4 kVA Power supply: 100-240 VAC, Single phase, 30 A, 50/60 HzOEM Model Description
Ball bonder, advanced wafer level bonding applications.Documents
No documents
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
133746
Wafer Sizes:
Unknown
Vintage:
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
AT PREMIER PLUS
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
133746
Wafer Sizes:
Unknown
Vintage:
2020
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Work size: 50-300 mm Wire diameter: 15-50 µm Interface: SECS II / GEM Bump placement accuracy: ±3.5 µm 2D Barcode reading Wafer mapping Vertical wire looping process Cu Wire bonding Au Wire: 0.6 to 2.0 mil Cu Wire: 0.7 to 1.5 mil LCD Monitor, 17" Lamp indicator: Tower type Hard Disk Drive (HDD) USB Driver Manuals included Noise level: 80 dB Maximum power consumption: 1.4 kVA Power supply: 100-240 VAC, Single phase, 30 A, 50/60 HzOEM Model Description
Ball bonder, advanced wafer level bonding applications.Documents
No documents