Description
No descriptionConfiguration
Automatic Ball Bonder 2.00” X 2.56” XY Bonding Area 0.8 to 2.0 mil Wire Diameter Bond Height Differential 0.080 in. Maximum Offset Between Highest First Bond and Lowest Second Bond Wire Cycle Time – 85 msec (Standard Loop) Loop Shape Options - User Selectable Standard/Low Loop/Worked Loop/Spider Loop/BGA 2 Loop/J-wire/Stitch/ Stand-off Stitch/Gold-Ball Bumping Maximum Wire Length 0.300 in. for Standard/Low Loop (Other Loop Shape Options May Increase/Decrease Maximum Wire Length) Automatic Magazine Handling System APPLIED INTELLIGENT SYSTEMS 640/266 VME Pattern Recognition System 1ea 3 ½” Floppy Disc DriveOEM Model Description
The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.Documents
No documents
KULICKE & SOFFA (K&S)
8028
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
93573
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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KULICKE & SOFFA (K&S)
8028
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Running
Product ID:
93573
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Automatic Ball Bonder 2.00” X 2.56” XY Bonding Area 0.8 to 2.0 mil Wire Diameter Bond Height Differential 0.080 in. Maximum Offset Between Highest First Bond and Lowest Second Bond Wire Cycle Time – 85 msec (Standard Loop) Loop Shape Options - User Selectable Standard/Low Loop/Worked Loop/Spider Loop/BGA 2 Loop/J-wire/Stitch/ Stand-off Stitch/Gold-Ball Bumping Maximum Wire Length 0.300 in. for Standard/Low Loop (Other Loop Shape Options May Increase/Decrease Maximum Wire Length) Automatic Magazine Handling System APPLIED INTELLIGENT SYSTEMS 640/266 VME Pattern Recognition System 1ea 3 ½” Floppy Disc DriveOEM Model Description
The Model 8028 ball bonder and began to shift production capacity from the Model 8020 ball bonder.Documents
No documents